The conventional way of testing silicon die strength is the three point bend test; The die is pushed down by a roller. (or indenter) in the centre and supported ...
PDF | The objective of this study is to evaluate the existing test methods of die strength, including widely-accepted three-point and four-point bending.
由 MY Tsai 著作 · 2008 · 被引用 51 次 — The three test methods for silicon die strength, including the point-load test, three-point bending and four-point bending tests, have been evaluated by testing ...
2016年6月10日 — Die strength was measured for 20 chips each at three saw mark angles: 0º, which is parallel to the indenter of the 3-point bending test, 45º, ...
The purpose of this test is to determine the integrity of materials and procedures used to attach semiconductor die or surface mounted passive elements to ...
This test not only provides the data which are merely dependent on the surface roughness and free from the edge chipping and grinding-mark direction effects, ...
由 DYR Chong 著作 · 被引用 79 次 — The current paper investigates an approach for the characterization of silicon die failure strength, employing a simple three-point bending test technique This ...
This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, ...
