Epoxy Molding Compound | 私立大學五星教授網

2021年11月10日 — 固態模封材料(Epoxy Molding Compound; EMC)主要是由環氧樹脂、酚醛樹脂、觸媒、二氧化矽微粉等組成，是發展最早、應用最成熟的環氧塑封料種類，如圖一。

EPOXY MOLDING COMPOUNDS. EME（環氧樹脂成型材料）主要用於半導體元件封裝用，具有優良的成型性、機械與電氣特性佳、高信賴度；廣泛被使用IC（Integrated Circuit）、Diode（ ...

Semiconductor molding compounds are fine filled, electrically stable compounds, ideal for the miniaturised semiconductor packaging requirements.

由 L Brunnbauer 著作 · 2023 · 被引用 2 次 — Epoxy molding compounds are the most commonly used composite material for encapsulation in the semiconductor industry. They consist of a polymer-based ...

Resonac's epoxy molding compounds is suitable for semiconductor packages assembled with organic substrates such as BGA and CSP.

We have cultivated the advanced technologies for Epoxy Molding Compound (EMC) over many years, and our EMC products have been used widely across many ...

Epoxy Mold Compounds (EMC) are formulations of thermosetting solid epoxy polymers, additives, and silica-based fillers. EMCs are used in industrial molding ...